Review of packaging technologies in microelectronics and DC analysis on multi chip modules
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Manuscript essay |
| Published: |
2008
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| Online Access: | https://diplomamunka.ppke.hu/79 |
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Manuscript essay |
| Published: |
2008
|
| Online Access: | https://diplomamunka.ppke.hu/79 |